- Heat-dissipating materials for electronic devices
- Mold release agents for discharge plasma sintering (SPS)
- Heat-dissipating sheets for tablets and notebook PCs
- Heat-dissipating adhesive presses, fireproof packing, and more
High thermal diffusion type
Normal type
Thickness | 0.06 mm | 0.12 mm | 0.30 mm |
---|---|---|---|
Density | 1.0–1.4 g/cm³ | 1.0–1.4 g/cm³ | 1.0–1.4 g/cm³ |
Thermal conductivity (Orientation) |
200 W/mK | 370 W/mK | 660 W/mK |
Thermal conductivity (Thickness direction) |
2.0 W/mK | 2.4 W/mK | 3.6 W/mK |
Standard width | 200 mm | 500 mm | 500 mm |
Standard length | 100 m | 100 m | 100 m |
Cutting to specified sizes, PET film lamination, and double-sided tape processing are available.